Research on the depth of field of soldering defect inspection for special integrated circuit units board

doi:10.13741/j.cnki.11-1879/o4.2015.03.016

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Research on the depth of field of soldering defect inspection for special integrated circuit units board

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- Research on the depth of field of soldering defect inspection for special integrated circuit units board
- Vol. 41, Issue 3, Pages: 261-264(2015)
- 作者机构：
  
  1:天津科技大学机械工程学院
- 作者简介：
- 基金信息：
- DOI：10.13741/j.cnki.11-1879/o4.2015.03.016
  CLC：
- Published：2015
- 稿件说明：
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Research on the depth of field of soldering defect inspection for special integrated circuit units board[J]. 2015, 41(3): 261-264.
DOI：

Research on the depth of field of soldering defect inspection for special integrated circuit units board[J]. 2015, 41(3): 261-264. DOI： 10.13741/j.cnki.11-1879/o4.2015.03.016.

摘要

检测具有特殊空间结构的IC板引脚焊点缺陷时

相机镜头相对于引脚平面会有一定的倾斜角度

在特定的范围内获取图像清晰

超过此范围图像出现离焦模糊。针对此问题进行了研究

建立了景深的数学模型

推导出合理拍摄角度的公式

并通过实验进行了分析和验证。

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